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  low-power off-line primary side regulation controller AP3703 preliminary datasheet 1 bcd semiconductor manufacturing limited . dec. 2011 rev. 1. 6 general description the AP3703 is a high performance ac/dc power sup- ply controller for battery charger and adapter applica- tions. the device uses pulse frequency modulation (pfm) method to build discontinuous conduction mode (dcm) flyback power supplies. the AP3703 provides accurate constant voltage, con- stant current (cv/cc) regulation while removing the opto-coupler and secondary control circuitry. it also eliminates the need of lo op compensation circuitry while maintaining stability. the AP3703 achieves excellent regulation and high average efficiency, yet meets the requirement for no-load consumption less than 100mw. the AP3703 is available in sot-23-5 package. features primary side control for rectangular constant current and constant voltage output secondary cv/cc control circuitry eliminating opto-coupler no need for control loop compensation circuitry flyback topology in dcm operation random frequency modulation to reduce system emi maximum switching frequency: 60khz built-in soft start open feedback protection over voltage protection short circuit protection small sot-23-5 package to achieve compact size and less component applications adapters/chargers for cell/cordless phones, pdas, mp3 and other portable apparatus standby and auxiliary power supplies led driver figure 1. package type of AP3703 sot-23-5
low-power off-line primary side regulation controller AP3703 preliminary datasheet 2 bcd semiconductor manufacturing limited . dec. 2011 rev. 1. 6 pin configuration figure 2. pin configuration of AP3703 (top view) k package (sot-23-5) pin description pin number pin name function 1 out this pin drives the base of external power npn switch 2 gnd ground 3 vcc supply voltage 4 cs the primary current sense 5 fb the voltage feedback from the auxiliary winding 1 2 34 5 cs out vcc gnd fb
low-power off-line primary side regulation controller AP3703 preliminary datasheet 3 bcd semiconductor manufacturing limited . dec. 2011 rev. 1. 6 functional block diagram figure 3. functional block diagram of AP3703 vcc out gnd fb cs regulator & bias tonsec detector 0.1v 4.0v pfm tons comp ea uvlo cv_ctrl pfm driver rq s rq s cc_ctrl 3 1 2 4 5 ockp peak current control & leb constant current control tons constant voltage control
low-power off-line primary side regulation controller AP3703 preliminary datasheet 4 bcd semiconductor manufacturing limited . dec. 2011 rev. 1. 6 parameter value unit supply voltage vcc -0.3 to 30 v voltage at cs, out to gnd -0.3 to 7 v fb input (pin 5) -40 to 10 v output current at out internally limited a operating junction temperature 150 o c storage temperature -65 to 150 o c lead temperature (soldering, 10s) 300 o c thermal resistance junction-to-ambient 250 o c/w esd (machine model) 200 v esd (human body model) 2000 v note 1: stresses greater than those li sted under "absolute maximum ratings" may cause permanen t damage to the device. these are stress ratings only, and functiona l operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. exposure to "absolute maximum ratings" for extended periods may affect device reliability. absolute maximum ratings (note 1) bcd semiconductor's products, as designated with "g1" suffix in the pa rt number, are rohs compliant and green. ordering information circuit type AP3703 - tr: tape and reel package k: sot-23-5 g1: green package temperature range part number marking id packing type sot-23-5 -40 to 85 o c AP3703ktr-g1 gat tape & reel
low-power off-line primary side regulation controller AP3703 5 bcd semiconductor manufacturing limited preliminary datasheet dec. 2011 rev. 1. 6 parameter symbol conditions min typ max unit uvlo section start-up threshold v th (st) 16.5 19.5 22.5 v minimal operating voltage v opr (min) 5.8 7.5 9.5 v standby current section start-up current i st v cc =v th (st) -0.5v, before start-up 45 60 a operating current i cc(opr) static 250 350 a drive output section out maximum current sink i out 50 ma source 24 32 40 maximum switching frequency 60 khz current sense section current sense threshold v cs 410 465 530 mv pre-current sense v cs(pre) 345 395 440 mv leading edge blanking 750 ns feedback input section feedback pin input leakage current i fb v fb =4v 22.83.6 a feedback threshold v fb 3.70 3.95 4.20 v over voltage protection v fb(ovp) 6.4 8 9.6 v (v cc =15v, t a =25 o c, unless otherwise specified.) electrical characteristics
low-power off-line primary side regulation controller AP3703 preliminary datasheet 6 bcd semiconductor manufacturing limited . dec. 2011 rev. 1. 6 typical performance characteristics figure 6. operating current vs. ambient temperature figure 4. start-up voltage vs. ambient temperature figure 5. start-up current vs. ambient temperature -40 -20 0 20 40 60 80 100 120 15 16 17 18 19 20 21 ambient temperature ( o c) start-up voltage (v) -40-20 0 20406080100120 0 20 40 60 80 100 ambient temperature ( o c) start-up current ( a) -40-20 0 20406080100120 100 150 200 250 300 350 400 ambient temperature ( o c) operating current ( a)
low-power off-line primary side regulation controller AP3703 preliminary datasheet 7 bcd semiconductor manufacturing limited . dec. 2011 rev. 1. 6 typical application figure 7. 5v/500ma output for battery charger of mobile phone + c1 + c4 v o + v o - r1 r3 r 4 r s q1 r6 r7 t1 d1 c2 vcc out fb cs gnd AP3703 n s nf b n p + r5 c3 d3 r2 d2
low-power off-line primary side regulation controller AP3703 preliminary datasheet 8 bcd semiconductor manufacturing limited . dec. 2011 rev. 1. 6 mechanical dimensions unit: mm(inch) sot-23-5 2.820(0.111) 2 . 6 5 0 ( 0 . 1 0 4 ) 1 . 5 0 0 ( 0 . 0 5 9 ) 0 . 0 0 0 ( 0 . 0 0 0 ) 0.300(0.012) 0.950(0.037) 0 . 9 0 0 ( 0 . 0 3 5 ) 0.100(0.004) 0.200(0.008) 0 . 3 0 0 ( 0 . 0 1 2 ) 8 0 3.020(0.119) 1 . 7 0 0 ( 0 . 0 6 7 ) 2 . 9 5 0 ( 0 . 1 1 6 ) 0.400(0.016) 0 . 1 5 0 ( 0 . 0 0 6 ) 1 . 3 0 0 ( 0 . 0 5 1 ) 0.200(0.008) 0 . 6 0 0 ( 0 . 0 2 4 ) 1.800(0.071) 2.000(0.079) 0 . 7 0 0 ( 0 . 0 2 8 ) r e f t y p 1 . 4 5 0 ( 0 . 0 5 7 ) m a x
important notice bcd semiconductor manufacturing limited reserves the right to make changes without further not ice to any products or specifi- cations herein. bcd semiconductor manufacturing limited does not as sume any responsibility for us e of any its products for any particular purpose, nor does bcd semiconductor manufacturi ng limited assume any liability aris ing out of the application or use of any its products or circui ts. bcd semiconductor manufacturing limited does not convey any license under its patent rights or other rights nor the rights of others. - wafer fab shanghai sim-bcd semiconductor manufacturing co., ltd. 800 yi shan road, shanghai 200233, china tel: +86-21-6485 1491, fax: +86-21-5450 0008 main site regional sales office shenzhen office shanghai sim-bcd semiconductor manuf acturing co., ltd., shenzhen office unit a room 1203, skyworth bldg., gaoxin ave.1.s., nanshan district, shenzhen, china tel: +86-755-8826 7951 fax: +86-755-8826 7865 taiwan office bcd semiconductor (taiwan) company limited 4f, 298-1, rui guang road, nei-hu district, taipei, taiwan tel: +886-2-2656 2808 fax: +886-2-2656 2806 usa office bcd semiconductor corp. 30920 huntwood ave. hayward, ca 94544, usa tel : +1-510-324-2988 fax: +1-510-324-2788 - headquarters bcd semiconductor manufacturing limited no. 1600, zi xing road, shanghai zizhu sc ience-based industrial park, 200241, china tel: +86-21-24162266, fax: +86-21-24162277 bcd semiconductor manufacturing limited important notice bcd semiconductor manufacturing limited reserves the right to make changes without further not ice to any products or specifi- cations herein. bcd semiconductor manufacturing limited does not as sume any responsibility for us e of any its products for any particular purpose, nor does bcd semiconductor manufacturi ng limited assume any liability aris ing out of the application or use of any its products or circui ts. bcd semiconductor manufacturing limited does not convey any license under its patent rights or other rights nor the rights of others. - wafer fab shanghai sim-bcd semiconductor manufacturing limited 800, yi shan road, shanghai 200233, china tel: +86-21-6485 1491, fax: +86-21-5450 0008 bcd semiconductor manufacturing limited main site regional sales office shenzhen office shanghai sim-bcd semiconductor manuf acturing co., ltd. shenzhen office advanced analog circuits (shanghai) corporation shenzhen office room e, 5f, noble center, no.1006, 3rd fuzhong road, futian district, shenzhen 518026, china tel: +86-755-8826 7951 fax: +86-755-8826 7865 taiwan office bcd semiconductor (taiwan) company limited 4f, 298-1, rui guang road, nei-hu district, taipei, taiwan tel: +886-2-2656 2808 fax: +886-2-2656 2806 usa office bcd semiconductor corporation 30920 huntwood ave. hayward, ca 94544, u.s.a tel : +1-510-324-2988 fax: +1-510-324-2788 - ic design group advanced analog circuits (shanghai) corporation 8f, zone b, 900, yi shan road, shanghai 200233, china tel: +86-21-6495 9539, fax: +86-21-6485 9673 bcd semiconductor manufacturing limited http://www.bcdsemi.com bcd semiconductor manufacturing limited


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